SUSS MicroTec and Thin Materials Cooperate on Temporary Bonding Solution for 3D Packaging

SUSS MicroTec (FWB:SMH)(GER:SMH), one of the leading suppliers of process and test solutions for microstructuring applications in semiconductor and related markets, and Thin Materials, a semiconductor process development company, announced today that they are cooperating on a temporary bonding solution to be used for challenging thin wafer handling technologies required for emerging 3D Integration and Packaging technologies. With this cooperation SUSS MicroTec extends its solution portfolio for temporary bonding and thin wafer handling.

The temporary bond material of Thin Materials is capable of handling wafer processing temperatures in excess of 250°C while being able to do a room temperature de-bond. This simplifies the debond process by eliminating a number of steps thus saving time and lowering device costs. The Thin Materials process runs on SUSS MicroTec’s production wafer bonder, XBC300, whose modularity and high process flexibility can easily be adapted for changing environments and processed material. The XBC300 temporary bond configurations are available for development and high volume needs.

“We have been working closely with SUSS MicroTec as one of the leading experts for 3D integration solutions”, states Dr. Franz Richter, CEO of Thin Materials AG, “We are looking forward to extending this partnership and jointly supply our customers with cutting-edge solutions.”

“Thin Materials’ technology for temporary bonding perfectly complements our process offering portfolio for 3D Integration and Packaging”, confirms Frank Averdung, President and CEO of SUSS MicroTec “Partnering with Thin Materials allows us to offer our customers a wide variety of temporary bonding technologies according to their specific needs.”

Together with its partners 3M, Disco, DuPont, NEXX Systems, Surface Technology Systems and Thin Materials SUSS MicroTec will host a TSV 3D Integration workshop introducing solutions for temporary bonding and thin wafer handling on July 15th during SEMICON West, San Francisco, USA.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of process and test solutions for markets such as 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor. High-quality solutions enable customers to increase process performance while reducing cost of ownership.

SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com

About Thin Materials

Thin Materials AG is a process technology provider working on a wafer support system for ultra thin wafer processing. Thin Materials is offering solutions for different applications including TSV processing for 3D-integration of advanced semiconductor chips. Process simplicity, high temperature capabilities beyond 250 °C and final wafer release from the carrier at room temperature provide excellent conditions for a cost effective wafer processing. Located in Munich, Germany, Thin Materials is cooperating with partners for technology development, with Waker Chemie AG on material optimization, SÜSS MicroTec on equipment adaption and Fraunhofer-Institue IZM on general R&D support. For further information, please contact info@thin-materials.com.