Form 6-K
SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D. C. 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
Pursuant to Rule 13a-16 or 15d-16 of
the Securities Exchange Act of 1934
For the month of October 2007
Commission File Number: 001-06439
SONY CORPORATION
(Translation of registrant's name into English)
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
(Address of principal executive offices)
The registrant files annual reports under cover of Form 20-F.
Indicate by check mark whether the registrant files or will file annual reports
under cover of Form 20-F or Form 40-F,
Form 20-F X Form 40-F __
Indicate by check mark whether the registrant by furnishing the information
contained in this Form is also thereby furnishing the information to the
Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934,
Yes No X
If "Yes" is marked, indicate below the file number assigned to the registrant in
connection with Rule 12g3-2(b):82-______
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned, thereunto duly authorized.
SONY CORPORATION
(Registrant)
By: /s/ Nobuyuki Oneda
(Signature)
Nobuyuki Oneda
Executive Vice President and
Chief Financial Officer
Date: October 18, 2007
List of materials
Documents attached hereto:
i) Press release announcing Sony Group Expands High-Performance Semiconductors
Manufacturing Alliances with IBM and Toshiba
ii) Press release announcing Toshiba, Sony, and SCEI Sign a Memorandum of
Understanding Establishing a Joint Venture to Strengthen Manufacturing
Capabilities for High-Performance Semiconductors
Sony Corporation
Sony Computer Entertainment Inc.
Sony Group Expands High-Performance Semiconductors
Manufacturing Alliances with IBM and Toshiba
TOKYO, JAPAN - Oct 18, 2007: Sony Corporation and Sony Computer Entertainment
Inc. (Sony Group) today announced two new and separate partnership agreements
with the goal of enhancing the capabilities of Sony Group's PlayStation
business.
1. IBM and Sony have signed an agreement to extend their existing manufacturing
relationship to 45-nanometer silicon-on-insulator (SOI) for high volume
production of the Cell Broadband Engine(TM) (Cell/B.E.) processor. Both
companies will collaborate to optimize the 45-nanometer manufacturing capability
to produce a lower power and lower cost processor for Sony Group's
PLAYSTATION(R)3. IBM will lead the evolution of the Cell/B.E. component by
transitioning production from the existing 65-nanometer generation to 45-
nanometer in IBM's manufacturing facility in East Fishkill, New York.
2. Separately, Sony Group will extend their alliance with Toshiba to manufacture
high-performance LSI by using 45-nanometer bulk process technology. By forming a
joint venture company that leverages the knowledge and experience of both
companies, Sony Group and Toshiba intend to improve power consumption and cost
competitiveness for game and digital media applications by advancing to the
45-nanometer generation from the existing 65-nanometer generation process.
Sony Group will advance the high-performance semiconductors used for PlayStation
while reducing costs by further strengthening its collaboration with its
respective partner companies. These enhancements will continue to strengthen the
leading capability of the PLAYSTATION(R)3 system and Sony Group's overall
PlayStation business.
"The transition to 45-nanometer SOI technology for the Cell Broadband Engine is
a critical step to advancing the world class processor cost and power
characteristics while maintaining supercomputer on chip performance capability"
said Adalio Sanchez, general manager for IBM Global Engineering Solutions. "The
IBM team is excited to lead the production of the 45-nanometer Cell/B.E.
processor in its East Fishkill 300mm facility and to help drive a broader use of
this capability as both power and size scale down significantly."
"Games are one of the focus areas for Sony Group's semiconductor business on
which we have been concentrating since earlier this year. At the same time, we
have carefully assessed the manufacturing investment plan for advanced process
technologies for 45-nanometer generation processes and beyond. We believe the
production alliances that we have formed with IBM and Toshiba to manufacture
high performance semiconductors for PlayStation by using state-of-the-art
process technologies will lead to the advancement of the high-performance
semiconductor business for PlayStation. Sony Group will collaborate with IBM and
Toshiba to expand its high-performance semiconductor business for PlayStation by
maximizing knowledge in high-performance semiconductor design capability it has
gained over the years," said Yutaka Nakagawa, Executive Deputy President,
Officer in charge of Semiconductor & Component Group, Sony Corporation.
"I am delighted with our respective collaborations with Toshiba and IBM, which
aim to achieve LSI scaling and power reduction by 45-nanometer-generation
process technology, and which will enable us to further drive the advancement
and cost reduction of semiconductor devices for PlayStation systems.
Cutting-edge semiconductors are core devices for the PlayStation platforms. With
the support of these strengthened relationships, SCE is committed to develop
further the PlayStation business and offer new and innovative interactive
entertainment," said Kaz Hirai, President and Group CEO, Sony Computer
Entertainment, Inc.
"This new cooperative relationship will enhance our production efficiency in
high-performance semiconductors for game consoles, and accelerate the early
migration of next generation process technology. Market growth of
high-performance semiconductors for game consoles, driven by strong demand for
such devices as the RSX graphics engine for PLAYSTATION(R)3, is expected to
continue and we will promote it as an important part of our System LSI business,
a strategic business area. We are happy to continue to support Sony Group's
PlayStation business through this new framework, and we aim to offer a steady
supply of high-performance semiconductors in next generation process technology
as soon as possible to support market expansion," said Shozo Saito, Corporate
Senior Vice President of Toshiba Corporation, President and CEO of Toshiba's
Semiconductor Company.
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October 18, 2007
Toshiba Corporation
Sony Corporation
Sony Computer Entertainment Inc.
Toshiba, Sony, and SCEI Sign a Memorandum of
Understanding Establishing a Joint Venture
to Strengthen Manufacturing Capabilities
for High-Performance Semiconductors
Tokyo, Japan, October 18, 2007---Toshiba Corporation, together with Sony
Corporation and Sony Computer Entertainment Inc. (Sony Group) today announced
that they have signed a non-binding memorandum of understanding expressing their
intent to establish a joint venture that will produce high-performance
semiconductors, including the 'Cell Broadband Engine(TM)' (Cell/B.E.) and the
'RSX' graphics engine, and to transfer to Toshiba from the Sony Group the 300mm
wafer line fabrication facilities installed in Fab 2 of Sony Semiconductor
Kyushu Corporation's Nagasaki Technology Center (SKC) by the end of March 2008.
Following the transfer, production on the line will be operated by the joint
venture. Subject to receipt of any necessary government approval and after
further due diligence, Toshiba and the Sony Group will aim to finalize the
definitive agreements as soon as possible before the end of March 2008.
This collaboration will allow Toshiba to expand and enhance its system LSI
business by increasing order volume and securing regular orders of
high-performance semiconductors for PlayStation, while the Sony Group will aim
for the further growth of the PlayStation business by achieving process
migration of high-performance semiconductors.
Toshiba and the Sony Group have forged a solid partnership in the development
and production of high-performance semiconductors for game consoles, including
PLAYSTATION(R)3. The new joint venture will further build on this record of
achievement by utilizing the 300mm wafer line fabrication facilities that
Toshiba will acquire from the Sony Group, where most production will focus on
65nm process semiconductors. Toshiba and the Sony Group will together promote
further advances in manufacturing technologies and efficiencies by leveraging
their knowledge and experience, targeting migration to 45nm process mass
production.
Concurrently, Toshiba and the Sony Group also signed a non-binding memorandum of
understanding on the transfer to Toshiba of the assets of the Sony Group on the
March 2008 expiry of Oita TS Semiconductor Corporation (OTSS) joint venture
between Toshiba and the Sony Group. Located within Toshiba's Oita Operations
semiconductor plant, OTSS was established to manufacture semiconductors for
PlayStation(R)2 in 1999. Toshiba and the Sony Group are also aiming to finalize
the definitive agreements on the transfer to Toshiba of the assets of the Sony
Group in OTSS as soon as possible before the end of March 2008.
Joint Venture Outline
Company name: To be determined
Establishment Date: April 1, 2008 (plan)
Location: 1883-43 Tsukuba-machi, Isahaya-city, Nagasaki, Japan
Capitalization: Approx. 100 million yen (plan)
Ownership: 60% Toshiba, 20% Sony, 20% SCEI
Representation: To be determined (Chairman and CEO to be appointed by Toshiba,
President and COO to be appointed by Sony)
Business: Manufacture of high-performance semiconductors, including 'Cell/B.E.'
and 'RSX' graphic engine, etc.
Employees: To be determined
Outline of OTSS
Company name: Oita TS Semiconductor Corporation
Established: June 1, 1999
Location: 3500 Oaza Matsuoka, Oita, Oita Prefecture (in Oita Operations, Toshiba
Corporation)
Ownership: 51% Toshiba, 49% Sony
Business: Manufacture of semiconductors for PlayStation
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