Form 6-K
SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D. C. 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
Pursuant to Rule 13a-16 or 15d-16 of
the Securities Exchange Act of 1934
For the month of February 2008
Commission File Number: 001-06439
SONY CORPORATION
(Translation of registrant's name into English)
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
(Address of principal executive offices)
The registrant files annual reports under cover of Form 20-F.
Indicate by check mark whether the registrant files or will file annual reports
under cover of Form 20-F or Form 40-F,
Form 20-F X Form 40-F __
Indicate by check mark whether the registrant by furnishing the information
contained in this Form is also thereby furnishing the information to the
Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934,
Yes No X
If "Yes" is marked, indicate below the file number assigned to the registrant in
connection with Rule 12g3-2(b):82-______
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned, thereunto duly authorized.
SONY CORPORATION
(Registrant)
By: /s/ Nobuyuki Oneda
(Signature)
Nobuyuki Oneda
Executive Vice President and
Chief Financial Officer
Date: February 20, 2008
List of materials
Documents attached hereto:
i) Press release announcing Toshiba, Sony, and SCEI outline new joint venture
for manufacturing high-performance semiconductors
February 20, 2008
Toshiba Corporation
Sony Corporation
Sony Computer Entertainment Inc.
FOR IMMEDIATE RELEASE
Toshiba, Sony, and SCEI outline new joint venture
for manufacturing high-performance semiconductors
Tokyo, Japan, February 20, 2008-Toshiba Corporation (Toshiba), Sony Corporation
(Sony) and Sony Computer Entertainment Inc. (SCEI) today announced that they
have signed a definitive agreement to form a new joint venture among the
companies for the production of high-performance semiconductors, including
products for SCEI's PlayStation computer entertainment systems. Toshiba, Sony
and SCEI started discussing the possibility of entering into a joint venture
last year, and today's agreement follows an October 18, 2007 memorandum of
understanding between the parties.
Under the terms of the definitive agreement, the joint venture, to be named at a
later date, will start operation from April 1, 2008 in Nagasaki Technology
Center of Sony Semiconductor Kyushu Corporation (SCK). It will be 60% owned by
Toshiba, and Sony and SCEI will each take a 20% stake. Within the fiscal year
ending March 31, 2008, Toshiba will acquire from Sony and SCK for approximately
90 billion yen, the 300mm wafer line installed in SCK's Nagasaki Technology
Center Fab2, with the exception of some equipment, and plans to make it
available to the joint venture at the start of operation. Details of the
operation including administrative and operation organization will be finalized
by the start-up date.
Semiconductors to be manufactured by the joint venture include the "Cell
Broadband Engine(TM)" (Cell/B.E.) processor, the "RSX" graphics engine and other
high-performance semiconductors for Sony Group, as well as Toshiba's leading
edge SoCs (System on Chip) for applications in digital consumer products.
Manufacturing will start with 65nm process, and the joint venture will promote
migration to 45nm process mass production, in cooperation with Toshiba's system
LSI manufacturing operation in Oita, while also working to achieve advances in
manufacturing technologies and efficiencies.
Outline of Joint Venture
------------------------
Company name: To be determined (at a later date)
Start of Operation: April 1, 2008 (scheduled)
Location: 6-30 Tsukuba-machi, Isahaya-city, Nagasaki, Japan
Capitalization: 100 million yen
Ownership: 60% Toshiba, 20% Sony, 20% SCEI
Representation: To be determined (Chairman and CEO to be appointed by
Toshiba, President and COO to be appointed by Sony)
Business: Manufacture of high-performance semiconductors,
including Cell/B.E., RSX graphic engine, and Toshiba's
leading edge SoCs for applications in digital consumer
products.