Vitesse CTO Outlines Blueprint to Future-Proof IoT Networks

Vitesse Semiconductor Corporation (Nasdaq: VTSS), a leading provider of advanced IC solutions for Carrier, Enterprise and Internet of Things (IoT) networks, announced that Martin Nuss, chief technology officer at Vitesse, will present a blueprint to future-proof Ethernet-based Internet of Things (IoT) networks at the Internet of Things Developers Conference 2014 in Santa Clara, Calif., May 7-8, 2014.

Click to Tweet: Service delivery, accurate timing, #security are critical to #IoT networks future; learn why at #IoT Devcon 2014 http://ctt.ec/47uTw+

Dr. Nuss’ session, “Ethernet Everywhere: Future-Proofing IoT Networks” will take place on Wednesday, May 7 at 3:00 pm local time. IoT network migration to Ethernet is prompting the technology to evolve and provide native support for deterministic service delivery, accurate timing and synchronization, and security. Session attendees will learn why these capabilities are essential and how they will help Ethernet meet some of the major challenges facing future IoT networks.

Dr. Nuss has over 20 years of technical and management experience and is a recognized industry expert in timing and synchronization for communications networks. Dr. Nuss serves on the board of directors for the Alliance for Telecommunications Industry Solutions (ATIS) and is a fellow of the Optical Society of America and IEEE member. He holds a doctorate in applied physics from the Technical University in Munich, Germany.

About Vitesse

Vitesse (Nasdaq: VTSS) designs a diverse portfolio of high-performance semiconductor solutions for Carrier and Enterprise networks worldwide. Vitesse products enable the fastest-growing network infrastructure markets including Mobile Access/IP Edge, Cloud Computing and SMB/SME Enterprise Networking. Visit www.vitesse.com or follow us on Twitter @VitesseSemi.

Vitesse is a registered trademark of Vitesse Semiconductor Corporation in the United States and other jurisdictions. All other trademarks or registered trademarks mentioned herein are the property of their respective holders.

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