Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fan-out wafer level packaging (FOWLP) applications.
“The JetStep System will be equipped with new hardware and software features that significantly increases our industry-best productivity. These upgrades will also be applied to the existing installed base, providing our customer with a significant capacity increase at a best-in-class cost-of-ownership," said Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. "The JetStep System continues to be the clear choice for advanced packaging fan-out wafer level processes due to its ability to handle warped wafers with varying die placement.”
“In addition to lithography, we are pleased to supply the latest 2D and 3D inspection and metrology solutions for the same FOWLP applications,” added Mike Goodrich, vice president and general manager of the Rudolph’s Inspection Business Unit. “Our newest NSX Systems offer the fast, reliable inspection and metrology needed for demanding advanced packaging applications, such as photoresist thickness and redistribution layer (RDL) and under bump metallization (UBM) height measurements.”
Further enhancing both the JetStep System and the NSX Systems is Rudolph’s Discover® Yield Management Software, which enables yield improvement through real-time analysis for faster solutions, increasing the productivity of each tool and the overall fab yield.
The JetStep Advanced Packaging Lithography Systems have been specifically designed to meet the challenges of back-end manufacturing. The systems address the needs of both the existing flip chip processes (bump and copper pillar), as well as emerging processes, such as fan-out wafer level packaging, interlopers and 3D approaches. The JetStep system is unique in its ability to not only handle standard wafers, but also a wide range of substrates and sizes with significant process-induced warp, while being capable to print fine features for large packages such as interlopers in a single shot. With these capabilities, the system provides the flexibility to meet the diverse manufacturing requirements of advanced packaging with superior throughput when compared to legacy lithography tools initially designed for the front-end, wafer-based processes.
The NSX family is the market leader for automated macro defect inspection for advanced packaging. The NSX system is a single solution that combines 2D inspection with 3D metrology. Discover software is Rudolph’s inline defect and metrology analysis and data management system.
For more information about Rudolph’s systems and software, please visit www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, advanced packaging lithography, process control metrology,
and data analysis systems and software used by semiconductor device
manufacturers worldwide. Rudolph provides a full-fab solution through
its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device
manufacturers to drive down the costs and time to market of their
products. The Company’s expanding portfolio of equipment and software
solutions is used in both the wafer processing and final manufacturing
of ICs, and in adjacent markets such as FPD, LED and Solar.
Headquartered in Flanders, New Jersey, Rudolph supports its customers
with a worldwide sales and service organization. Additional information
can be found on the Company’s website at www.rudolphtech.com.
Safe Harbor Statement
This press release contains
forward-looking statements within the meaning of the Private Securities
Litigation Reform Act of 1995 (the “Act”) which include the benefits to
customers of Rudolph’s products, Rudolph’s business momentum and future
growth, Rudolph’s existing market position and its ability to maintain
and advance such position relative to its competitors and Rudolph’s
ability to meet the expectations and needs of our customers as well as
other matters that are not purely historical data. Rudolph wishes to
take advantage of the “safe harbor” provided for by the Act and cautions
that actual results may differ materially from those projected as a
result of various factors, including risks and uncertainties, many of
which are beyond Rudolph’s control. Such factors include, but are not
limited to, delays in shipping products for technical performance,
component supply or other reasons, the company’s ability to leverage its
resources to improve its positions in its core markets and fluctuations
in customer capital spending. Additional information and considerations
regarding the risks faced by Rudolph are available in Rudolph’s Form
10-K report for the year ended December 31, 2014 and other filings with
the Securities and Exchange Commission. As the forward-looking
statements are based on Rudolph’s current expectations, the company
cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to
update the forward-looking information contained in this press release.
Contacts:
Investors:
Steven R. Roth,
973-448-4302
steven.roth@rudolphtech.com
or
Guerrant
Associates
Laura Guerrant-Oiye, 808-882-1467
Principal
lguerrant@guerrantir.com
or
Trade
Press:
Amy Shay, 952-259-1794
amy.shay@rudolphtech.com