Rudolph Technologies to Present at Second Quarter 2017 Investor Conferences

Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that Michael P. Plisinski, chief executive officer, and Steven R. Roth, chief financial officer, will be participating in several investor conferences during the Company’s second quarter. The presentation materials utilized during the respective conferences will be made accessible on the investor page of Rudolph Technologies’ website at www.rudolphtech.com.

18th Annual B. Riley Investor Conference / May 24, 2017 / Santa Monica, CA
Rudolph’s presentation at the 18th Annual B. Riley Investor Conference is scheduled for Wednesday, May 24, at the Loews Hollywood Hotel, in Santa Monica, CA. The presentation, which consists of a fireside chat moderated by B. Riley’s semiconductor capital equipment analyst Craig Ellis, will be at 1:30 p.m. PDT. Rudolph management will be available to meet one-on-one with investors during the conference. Interested investors should contact their B. Riley sales representative to secure a meeting time.

Cowen 45th Annual TMT Conference / May 31, 2017 / New York, NY
Rudolph’s presentation at the Cowen 45th Annual TMT Conference is scheduled for Wednesday, May 31, at the Lotte New York Palace, in New York, NY. The presentation will be at 2:45 p.m. EDT. Rudolph management will be available to meet one-on-one with investors during the conference. Interested investors should contact their Cowen sales representative to secure a meeting time.

Stifel 2017 Technology, Internet & Media Conference / June 6, 2017 / San Francisco, CA
Rudolph’s presentation at the Stifel 2017 Technology, Internet & Media Conference is scheduled for Tuesday, June 6, at the Fairmont Hotel, in San Francisco, CA. The presentation will be at 1:15 p.m. PDT. Rudolph management will be available to meet one-on-one with investors during the conference. Interested investors should contact their Stifel sales representative to secure a meeting time.

About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

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