Micron Technology, Inc. (NYSE:MU), today officially opened a new manufacturing facility in Xi’an, China. The facility, Micron’s first manufacturing facility in China, is designed for assembly and test operations for Micron’s semiconductor products, including dynamic random access memory, NAND flash memory and CMOS image sensors.
Micron hosted a ceremony at the facility with company, government and community officials on hand. The facility is expected to be built-out by the end of 2008 at an investment of $250 million and support up to 2,000 employees. The plant is Micron’s second assembly and test facility in Asia, with its first being opened in Singapore in 1998. Additionally, Micron’s Xi’an facility will be one of the largest investments of the 860 foreign-invested companies operating in the Xi’an High Tech Zone in Shaanxi Province in Midwest China.
“At Micron, we combine application-specialized products with value-added expertise and manufacturing process leadership to help our customers compete with confidence on a global scale,” said Steve Appleton, Micron Chairman, CEO and President. “By opening this facility in Xi’an, we are enabling customers and partners to design applications with service, support and quality from Micron, and we are pleased to be a growing part of the China technology industry.”
While the Xi’an facility is Micron’s first manufacturing plant in China, the company is no stranger to the China business community. Micron first came to China in 2001 to service its growing customer base from an office in Xiamen. In 2004, Micron established Micron Semiconductor Shanghai in Shanghai with about 60 employees and branch offices in Beijing and Shenzhen to provide corporate, sales and marketing services throughout China. That same year, Micron also chose Shanghai as the location of one of the company’s integrated circuit design centers and formed Micron Semiconductor Technology. With about 50 employees, Micron Semiconductor Technology is a key hub in Micron’s network for providing support to a variety of Asia-based mobile phone and consumer electronic device manufacturers. Media kit information on Micron’s Xi’an grand opening can be found at http://www.micron.com/media/2007mediakit/corp_xian_media_kit.aspx.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
This press release contains forward-looking statements regarding the completion date and number of employees at the Xi’an facility. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Company files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically the Company's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for the Company on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. We are under no duty to update any of the forward-looking statements after the date of this press release to conform to actual results.
