Rubicon Says Patent Allowed for Ultra-Flat, High-Throughput Wafer Lapping
December 18, 2012 at 16:34 PM EST
Rubicon Technology, Inc. (NASDAQ: RBCN ), a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that the United States Patent and Trademark Office (USPTO) has allowed Rubicon's patent application entitled, “Ultra-Flat, High-Throughput Wafer Lapping Process.” The patent covers Rubicon's process developed to perform grinding and polishing