• Designed to meet throughput and yield demands driven by AI, high-performance computing, and advanced semiconductor packaging applications

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.

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Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL precision fluid dispensing system for panel-level packaging (PLP) at SEMICON Taiwan 2026. The Vantage-XL is designed to meet the throughput and yield demands driven by AI, high-performance computing, and advanced semiconductor packaging applications. PLP enables higher throughput and lower manufacturing costs compared to wafer-level operations, especially as package sizes grow and semiconductor manufacturing demands accelerate.

The ASYMTEK Vantage XL extends Nordson's proven Vantage dispensing platform to larger panel formats, enabling manufacturers to develop next-generation advanced packaging processes and scale production with greater accuracy, throughput, and process control.

Panel-level packaging (PLP) enables higher throughput and lower manufacturing costs compared to wafer-level operations, especially as package sizes grow and throughput demands accelerate for artificial intelligence (AI) applications and automotive electrification. However, scaling large-format panels introduces challenges including warpage control, thermal management, and dispensing accuracy, all of which require specialized process controls.

Designed specifically to address these challenges in PLP, the ASYMTEK Vantage XL Fluid Dispensing System delivers:

• Improved dispensed underfill flow and warpage mitigation for void-free results.
• Flexible tooling support for large panel sizes during semiconductor manufacturing.
• Integrated thermal management for rapid heating and temperature uniformity across the substrate.
• Multi-fiducial capture for fast, accurate alignment.
• Confocal height sensing for reflective and transparent glass panels.
• Post-dispense inspection for efficient and process rework.
• Based upon the popular Vantage dispensing system, in a larger platform frame to accommodate common panel sizes.

The new ASYMTEK Vantage XL fluid dispensing system will be on display during SEMICON Taiwan 2026, booth #I2308. In addition, Nordson will highlight the new MARCH ExoSPHERE™ plasma treatment system, which supports advanced packaging processes by providing uniform surface preparation for panels and wafers. SEMICON Taiwan 2026 will be held at TaiNEX Hall 1, Taipei, Taiwan, September 2-4, 2026.

About Nordson Electronics Solutions

Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed.

About Nordson Corporation

Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com.

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The ASYMTEK Vantage® XL addresses the unique challenges of panel-level packaging with enhanced dispensing accuracy, warpage mitigation, and higher throughput capabilities