EcoSys (Malaysia) Berhad Launches Prospectus for ACE Market IPO, Set to Raise RM39.34 Million

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KUALA LUMPUR, MY / ACCESS Newswire / September 23, 2026 / EcoSys (Malaysia) Berhad ("EcoSys" or the "Company"), an industrial solutions provider serving the pan-semiconductor industry, officially launched its prospectus today in conjunction with its upcoming initial public offering ("IPO") on the ACE Market of Bursa Malaysia Securities Berhad ("Bursa Securities").

From L-R: Datuk Kelvin Khoo, Group Chief Executive Officer, Eco Asia Capital Advisory Sdn Bhd; Mr. Gan Teck Hooi, Non-Independent Non-Executive Chairperson, EcoSys (Malaysia) Berhad; Mr. Chan Chee Wei, Managing Director, EcoSys (Malaysia) Berhad; Datuk Bill Tan, Managing Director, M & A Equity Holdings Berhad; Mr. Danny Wong, Deputy Head of Corporate Finance, M & A Securities Sdn Bhd; and Mr. Woon Soon Fai, Managing Director, Eco Asia Capital Advisory Sdn Bhd.

EcoSys and its subsidiaries ("EcoSys Group" or "Group") provides two complementary categories of industrial solutions: ultra-high purity ("UHP") fabrication of precision engineering components and sub-assembly modules, and the research and development ("R&D"), customisation, assembly, installation, testing, commissioning and maintenance of abatement systems. Its solutions support applications across semiconductor manufacturing equipment, front-end semiconductor manufacturing equipment, solar photovoltaic ("PV") panels manufacturing equipment and industrial gas supply systems.

The IPO comprises a public issue of 145.70 million new ordinary shares, representing approximately 25.5% of EcoSys' enlarged issued share capital of 571.35 million shares upon listing. The IPO shares will be issued at an IPO price of RM0.27 per share, raising gross proceeds of approximately RM39.34 million for the Group. There is no offer for sale under the IPO.

Proceeds from the IPO will be utilised as follows:

  • RM17.00 million for the expansion of the abatement segment through the purchase of key components and modules of abatement systems.
  • RM8.00 million for the repayment of bank borrowings.
  • RM4.93 million for the enhancement of operational capabilities through the purchase of machines and expansion of the Group's team.
  • RM1.54 million for the expansion of geographical coverage in India, including the establishment of an India sales and service centre and recruitment of local personnel.
  • RM2.36 million for working capital to support day-to-day operations.
  • RM5.50 million for estimated listing expenses.

The semiconductor industry is witnessing a shift in global landscape as India is emerging as a potential production hub for semiconductor manufacturing. As part of its geographical expansion strategy, EcoSys plans to establish a dedicated sales and service centre in India to strengthen its marketing presence and customer support capabilities. India contributed RM38.22 million, or 35.1%, of the Group's revenue in FYE2025. During the financial period under review and up to the latest practicable date ("LPD"), EcoSys had also secured 7 new customers in India for its abatement segment, reflecting growing demand for its abatement systems in the market.

Mr. Chan Chee Wei, Managing Director of EcoSys (Malaysia) Berhad said, "The launch of our prospectus marks an important milestone for EcoSys as we move closer to our listing on the ACE Market. The IPO proceeds will support the expansion of our abatement segment, strengthen our UHP fabrication and operational capabilities, and advance our presence in India. We believe these initiatives will enhance our ability to serve customers and provide a stronger platform for sustainable growth across the regional pan-semiconductor ecosystem."

Datuk Bill Tan, Managing Director of M & A Equity Holdings Berhad remarked, "EcoSys has developed a differentiated position through the combination of established UHP fabrication capabilities and its own proprietary abatement systems. The Group has also demonstrated its ability to serve customers across multiple international markets, supported by technical know-how and a growing product portfolio. With the proceeds from this IPO, EcoSys will be better positioned to enhance its operating capabilities, support a higher level of business activity and strengthen its presence in India. We are pleased to support the Group as it progresses towards its listing on the ACE Market."

Datuk Kelvin Khoo, Group Chief Executive Officer of Eco Asia Capital Advisory Sdn Bhd added, "The IPO represents a strategic step in EcoSys' development, with the proceeds directed towards initiatives that can strengthen both its operational foundation and future growth capacity. The planned purchase of abatement components and modules, investment in new machinery, recruitment of talent and set up of the India sales and service centre are expected to enhance the Group's ability to respond to evolving customer requirements and pursue new opportunities. The listing will also raise EcoSys' corporate profile and provide it with greater financial flexibility as it continues to expand."

M & A Securities Sdn Bhd is the Principal Adviser, Sponsor, Underwriter, and Placement Agent for the IPO while Eco Asia Capital Advisory Sdn Bhd is the Financial Adviser.

###

ABOUT ECOSYS (MALAYSIA) BERHAD

EcoSys Group principally serves the pan-semiconductor industry through the provision of UHP fabrication of precision engineering components and sub-assembly modules, as well as the R&D, customisation, assembly, installation, testing, commissioning and maintenance of proprietary abatement systems. Its products and services support applications in semiconductor manufacturing equipment, front-end semiconductor manufacturing equipment, solar PV panels manufacturing equipment and industrial gas supply systems.

For more information, visit https://www.ecosysgrp.com/.

Issued By: Swan Consultancy Sdn Bhd on behalf of EcoSys (Malaysia) Berhad

For more information, please contact:

Jazmin Wan
Email: j.wan@swanconsultancy.biz

Xinyi Ching
Email: x.ching@swanconsultancy.biz

SOURCE: EcoSys (Malaysia) Berhad



View the original press release on ACCESS Newswire

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